Insulation panels PIR SOFT
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Insulation panels PIR SOFT LE

INCREASING ENERGY EFFICIENCY REQUIREMENTS IN CONSTRUCTION PRESENT NEW CHALLENGES FOR INVESTORS AND CONTRACTORS.
To meet these growing demands, we offer the PIR SOFT LE insulation board, which is the key to achieving high thermal comfort while keeping heating costs low.

This board features an exceptional thermal conductivity coefficient of λ = 0.022 W/m•K, ensuring outstanding thermal insulation. The PIR SOFT LE board consists of two flexible, gas-tight metallized foil facings with a rigid PIR foam insulation core in between. The board is available in two versions: with straight edges (SE) or L-shaped edges on all four sides (LS).

Types of PIR SOFT LE

PIR-SOFT F2

PIR SOFT LE LS

insulation panels with L shaped edges on all four sides

PIR-SOFT F4

PIR SOFT LE SE

Insulation panels with straight edges

MORE ABOUT PIR SOFT LE PANELS

ADVANTAGES OF PIR SOFT LE INSULATION PANELS

▪ Excellent thermal insulation – λD = 0.022 W/m·K,
▪ Easy and quick installation,,
▪ Outstanding dimensional stability under changing operating conditions, preventing the formation of thermal bridges,
▪ Resistance to fungi and mold due to the closed-cell structure with gas-tight facings,,
▪ No biological threats – rodents do not penetrate the rigid PIR foam, ensuring long-term durability of the material without the need for replacement.

APPLICATION:

PIR SOFT LE insulation boards are an excellent material for use as insulation for low-slope flat roofs in various types of buildings, including:

  • Industrial buildings, such as warehouses, production halls, and logistics facilities,
  • Commercial buildings, including shopping centers, retail stores, and hotels,
  • Residential buildings, such as single-family homes, apartment blocks, and multi-family buildings,
  • Public and institutional buildings, such as schools, hospitals, government offices, and sports facilities.
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ENERGY EFFICIENCY

They help to build a facility which is provided with an excellent thermal insulation and protected against loss of heat. With use of PIR SOFT LE insulation panels it is possible to achieve the same insulating power with a lower thickness compared to mineral wool or expanded polystyrene foam, which proves that Paneltech PIR SOFT LE insulation panels are the most efficient out of all commercially available insulating materials.

TABLE OF TECHNICAL PARAMETERS OF PIR SOFT LE PANELS

Parameters Value
Thickness [mm] 50* 60 80 100 120 140 150* 160
Application Insulation for flat roofs and low-slope roofs
Type of milling LS – L-shaped edges
SE – straight edges
Coverage length [mm] 2400 (SE) or 2385 (LS)
Coverage width [mm] 1200 (SE) or 1185 (LS)
Coverage area [m2] 2,88 (SE) or 2,83 (LS)
Thermal resistance R [m2K/W] 2,25 2,70 3,60 4,50 5,45 6,35 6,80 7,25
Thermal conductivity coefficient of panel λD [W/m·K] 0,022 (in accordance with EN 13165:2012+A2:2016 standard)
Reaction to fire class E
Compressive strength (10% strain) [kPa] ≥ 150 kPa (1,5 kg/cm2)
Insolation core Rigid PIR foam with a density of 32 ± 3 kg/m³ and a closed-cell structure
Facing LE: multilayer gastight laminate
Boards per pack 10 8 6 5 4 3 3 3
m2 perpack 28,80 23,04 17,28 14,40 11,52 8,64 7,32 7,32
Boards per pallet 50 40 30 25 20 18 15 15
m2 per pallet 144,00 115,20 86,40 72,00 57,60 51,84 43,20 43,20
m2 full load 1584,00 1267,20 950,40 792,00 633,60 570,24 475,20 475,20

*For the SE board variant, please inquire about availability.

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